Tech-Driven Connecting the Future
Focused on high-reliability connectors, cable assemblies and high-speed interconnect products for semiconductor testing, instrumentation and advanced computing platforms.
Core technology capabilities
Built around semiconductor testing, precision interconnect and system-level engineering, with deeper coverage from product architecture to reliability validation.
Interconnect product design
Covers Pogo, LIF, coaxial, golden-finger and cable assembly designs for ATE and high-end instrumentation applications.
Reliability validation
Supports signal integrity, current capacity, thermal rise, life-cycle, structural and mechanical validation.
System-level solutions
Provides application-specific interconnect module solutions from resource boards to CP/FT user interfaces.
Product technology
Complete interconnect capability from product to system
For semiconductor testing, high-end instrumentation, communications and radar test scenarios, TMXTECH provides connectors, cable assemblies, high-frequency/high-speed interconnects and system-level application support.
- Core interconnect architectures including Pogo, LIF, coaxial and golden-finger solutions
- Coverage for SOC, Memory, CIS, Burn-in, LCD Driver and other test applications
- Supports multi-specification product roadmaps for high speed, high frequency, high voltage and high current
150+
Team size
45%
R&D staff ratio
30+ years
Core team industry experience
6250㎡
Intelligent manufacturing workshop
Microelectronics innovation
Core capabilities
01
Product technology
High-end connectors, cable assemblies and high-frequency/high-speed interconnect products.
02
R&D and manufacturing
Forward design, simulation validation, automated production and quality control.
03
Industry solutions
For semiconductor testing, instrumentation, communications radar and advanced computing platforms.
04
Long-term delivery
Project collaboration from sample support and reliability validation through volume delivery.
From PDF profile
ATE product layout
01
Test scenario coverage
For SOC, Memory, CIS, Driver, Burn-in and other ATE test equipment.
02
Interconnect architecture
Builds interconnect links from resource boards to user interfaces with Pogo, LIF, coaxial and golden-finger solutions.
03
Frequency roadmap
RF connectors cover 40GHz-110GHz production capability, with 250GHz products under ongoing development.
04
Manufacturing assurance
ERP and MES production process management, with a 2,250 sqm workshop and clean environment supporting stable delivery.
Engineering and manufacturing
R&D, manufacturing and delivery capabilities
TMXTECH operates an intelligent manufacturing base, automated production lines, advanced inspection equipment and systematic production management, supporting complex harnesses, connector assemblies, Pogo inspection, welding, cleaning, potting, comprehensive testing and SI testing.
- 6,250 sqm production workshop and clean environment
- ERP and MES production process management
- Automated assembly, complex harness and test validation capabilities
- From sample support to volume delivery
Build high-reliability microelectronics interconnect solutions together
Tell us your equipment type, test scenario, frequency/current and reliability requirements. We will help complete the initial solution assessment.