About TMXTECH
About Us
Driving microelectronics innovation since 2021, TMXTECH delivers high-reliability interconnect, chip connection and test solutions for global markets.
About US
TMXTECH Profile
Founded in February 2021, TMXTECH is a Zhejiang-supported technology enterprise with R&D and intelligent manufacturing capabilities across Shanghai and Hangzhou.
The company focuses on the design, development, manufacturing and assembly of high-end connectors and cable interconnect products for integrated circuits, AI computing, high-end electronic measurement instruments and semiconductor ATE testing.
Guided by the strategy of technology leadership and future-ready connectivity, TMXTECH combines local engineering depth with a global market view to deliver reliable products and integrated interconnect solutions.
Milestones
From foundation to R&D setup, product planning and mass production, TMXTECH is building long-term capabilities step by step.
2021
Founded in Hangzhou in February 2021
- TMXTECH was founded in Hangzhou in February 2021.
2023
R&D centers and intelligent manufacturing bases established in Shanghai and Hangzhou
- Established R&D centers and intelligent manufacturing bases in Shanghai and Hangzhou.
2025
Market planning and product R&D design
- Advanced market planning and product R&D design.
2026
Semiconductor testing and high-end interconnect products reach mass production
- Semiconductor testing and high-end interconnect products reach mass production.
Company profile
High-end interconnects, connecting the future
TMXTECH builds integrated R&D, manufacturing, quality and supply capabilities around technology innovation and engineering enablement.
- Hangzhou headquarters with Shanghai and Hangzhou R&D/manufacturing collaboration
- Experienced team in semiconductor and high-end interconnect industries
- Stable, reliable and sustainable delivery for domestic and overseas customers
News
News
2026
Quality certification program
ISO 9001, ISO 14001 and ISO 45001 systems are in progress.
2025
Core product mass production
Semiconductor ATE and high-end interconnect products entered mass production.
2023
Base capability buildout
R&D centers and intelligent manufacturing bases continued to improve.